Application
Electronics Industry
Back Grinding WheelsNickel Bond Dicing BladesMetal Bond Dicing BladesResin Bond Dicing BladesCeramic Chuck TablesFlangeUV Tape Dressing BoardsDiamond Slurry
Diamond Core DrillDiamond Wheels for Edge-GrindingDiamond BladeGrinding Wheels for LED Substrate(CMP) Ceramic BlockCeramic RingEtching TrayCeramic Arm Electroplated Tools for Screen Panel 3C Precision Bearing
Ceramic Ring
Main features
The ceramic grinding ring is made of high-purity alumina powder, It has advantages like high hardness, high precision, good shape retention, no need for dressing and long life. It is especially suitable for the grinding and polishing process of for wafer or chip. It can realize on-line high-precision dressing of the grinding disc and uniform dispersion of the grinding liquid.
Application
For back grinding and polishing process of LED substrate and epitaxial wafers with high precision . It can realize on-line high-precision dressing of the grinding disc and uniform dispersion of the grinding liquid.
Matched machine: Speedfam, NTS, Galaxies and so on.
