Application
Electronics Industry
Back Grinding WheelsNickel Bond Dicing BladesMetal Bond Dicing BladesResin Bond Dicing BladesCeramic Chuck TablesFlangeUV Tape Dressing BoardsDiamond Slurry
Diamond Core DrillDiamond Wheels for Edge-GrindingDiamond BladeGrinding Wheels for LED Substrate(CMP) Ceramic BlockCeramic RingEtching TrayCeramic Arm Electroplated Tools for Screen Panel 3C Precision Bearing
Back Grinding Wheels
Back grinding wheels are mainly used for the thinning and grinding of the semiconductor wafers.
Matched Grinding Machine: Japanese, German, American, Korean and Chinese grinders. Good TTV and less damage section.
Workpiece：discrete devices, integrated chips(IC) and virgin silicon wafer of etc.
Material of workpiece: Silicon, GaAs , InP , SiC and some other semiconductor materials.
Application
Back thinning, rough grinding and fine grinding.
Main features
Easy grinding with low and consistent current.
No edge chipping and less damage.
Long wheel life.
