Application
Electronics Industry
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Metal Bond Dicing Blades
Product overview
Metal bond dicing blades are made of identical material,with thin thickness and high precision, they are mainly used for grooving and cutting with high accuracy and narrow cutting depth.
Main features
The grits are strongly held by the metal bond, high precision, minimized blade wear, good shape keeping ability and long life time.
Application
Semiconductor, such as BGA, LGA, LED, diode and so on.
Optical glass, such as filter, blue glass, crystal and gem.
Optical communication, such as slotting shape on quartz and cutting off quartz cover.
Other material, such as slotting and cutting off magnetic materials, carbide, tool steel and stainless steel.
