Application
Electronics Industry
Back Grinding WheelsNickel Bond Dicing BladesMetal Bond Dicing BladesResin Bond Dicing BladesCeramic Chuck TablesFlangeUV Tape Dressing BoardsDiamond Slurry
Diamond Core DrillDiamond Wheels for Edge-GrindingDiamond BladeGrinding Wheels for LED Substrate(CMP) Ceramic BlockCeramic RingEtching TrayCeramic Arm Electroplated Tools for Screen Panel 3C Precision Bearing
(CMP) Ceramic Block
Ceramic block is made of high purity and ultra-fine alumina powder by high temperature curing.
Main features
High purity, less impurities, high hardness,wear resistance and corrosion resistance.
High precision, small thermal expansion coefficient and good accuracy retention, good wear resistance and corrosion resistance.
Application
It is mainly used for thinning, hard polishing and CMP polishing of LED substrate and semiconductor wafers(sapphire wafer, SiC wafer,silicon wafer, germanium wafer, GaAs wafer, GaN wafer, etc.).
