Application
Electronics Industry
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Resin Bond Dicing Blades
Product overview
Resin bond dicing blades without steel core is mainly used for precision cutting and slotting for semiconductor, optical glass, quartz glass,ceramics and so on.
Main features
Sharpness cutting and elastic bond can improve the surface quality.
High precision, less dressing or no need to dress.
Widely used, variety specifications, short delivery time.
