UV tape is a special tape, which has excellent adhesiveness under normal conditions. But its adhesiveness decreases rapidly after exposure of UV light. UV tape usually used as carrier tape and protective substrate during the dicing and grinding process.

UV tape is mainly composed of release film, acrylic adhesive and base film.

Main application

Semiconductor: Dicing of various types of package（BGA/QFN/DFN）, wafer sawing and grinding.

Optoelectronics: Slotting, dicing and pickling of coated glass and ordinary glass.

Others: Process in which work piece should be covered when machining and uncovered after that without adhesive residue.