Abrasive special equipment
Counter-flow Mixing MachinesCold Presses Curing OvensHot Blast Curing Ovens Thermally Powered by Natural Gas Sintering FurnacesAbrasive Belt Conversion EquipmentAutomatic Production Line for Resin Bonded Heavy Load Grinding Wheels
3D Blenders TD SeriesSintering PressesPress FurnacesHydraulic PressesAutomatic Production Line for Resin Bonded Polishing ToolsRobot Workstations for Resin Bonded Super-hard Abrasive ToolsAutomatic Pressing and Sintering Workstation for Drawing DiesGrinders
QPQ Equipment
After 10 years of experimental research, we successful developed the second generation of QPQ technology - deep QPQ technology. The thickness of compound layer was increased from the original 15 ~ 20 microns to more than 30 ~ 40 microns. Picture 1 shows Metallographic photos for Deep QPQ treatment and general QPQ technology treatment.
It has been proved by abrasion resistance test, corrosion test, mechanical property test and permeability layer microstructure test that component compound layer thickness is multiplied and work piece’s various performances are greatly improved after second generation QPQ treatment.
