Superhardabrasive
Resin Cutting BladesGrinding Wheels for PCB ToolsGrinding Wheels for Wooden Cutting ToolsPeriphery Grinding WheelsCNC Grinding WheelSuperabrasive Wheels for Peel GrindingCenterless Grinding Wheels
Grinding DiscsVitrified Bond CBN Grinding Wheels for Gearbox PartsSuperabrasive Internal Grinding Wheels
Diamond Wire Drawing Die BlankMetal Bond Cutting BladesGrinding Wheels for LED SubstrateHoning SticksMetal Bond Dressing RollersDiamond Wheels for Edge-Grinding
Electroplated CBN for Gearbox Parts Diamond Dressing Rollers for Form GrindingElectroplated Deburring WheelElectroplated CBN Wheels
Grinding Wheels for LED Substrate
Application
The grinding wheels for LED substrate are mainly used for back thinning of 2”, 4” and 6”LED epitaxial wafers. They can be used steadily on the Japanese, Korean and Taiwanese grinders with high performance.
Workpiece: sapphire epitaxial wafer, SiC substrate epitaxial wafer, Si substrate epitaxial wafer.
Material of workpiece: Synthetic sapphire, SiC ,single crystal silicon.
Grinders: WEC , GALAXY ,SPEEDFAM , NTS , SHUWA , OKAMOTO.
