Application
Electronics Industry
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Etching Tray
Main features
The etching tray is made of high purity sintered silicon carbide ceramics without pressure.It has the characteristics of high hardness, corrosion resistance, wear resistance, long service life, high precision and good etching uniformity of wafer epitaxy layer.
Application
ICP etching process of epitaxial film materials(GaN, SiO 2, etc.) for LED wafer chips, precision ceramic parts for semiconductor diffusion and MOCVD epitaxy process for semiconductor wafers.
Specification
Diameter range: 50~500mm. thickness:3~20mm, custom-made specifications are available.
