Application
Electronics Industry
Back Grinding WheelsNickel Bond Dicing BladesMetal Bond Dicing BladesResin Bond Dicing BladesCeramic Chuck TablesFlangeUV Tape Dressing BoardsDiamond Slurry
Diamond Core DrillDiamond Wheels for Edge-GrindingDiamond BladeGrinding Wheels for LED Substrate(CMP) Ceramic BlockCeramic RingEtching TrayCeramic Arm Electroplated Tools for Screen Panel 3C Precision Bearing
Nickel Bond Dicing Blades
1. Nickel Blades for Wafer Dicing
Main features
Stable dicing performance of narrow street wafers.
Applications
Silicon wafer, compound semiconductor wafers (GaAs, GaP), oxide wafer (LiTaO3) and others.
2. Nickel Blades for Package Singulation
Main features
A combination of nickel bond and larger size diamond grits provides long blade life performance.
Applications
Alumina ceramics, EMC, PCB and various semiconductor package substrates.
